JPS59156725A - 射出成形機のノズル装置 - Google Patents

射出成形機のノズル装置

Info

Publication number
JPS59156725A
JPS59156725A JP3161883A JP3161883A JPS59156725A JP S59156725 A JPS59156725 A JP S59156725A JP 3161883 A JP3161883 A JP 3161883A JP 3161883 A JP3161883 A JP 3161883A JP S59156725 A JPS59156725 A JP S59156725A
Authority
JP
Japan
Prior art keywords
poppet
nozzle
hole
resin
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3161883A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0332451B2 (en]
Inventor
Nobuo Hori
信夫 堀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanjo Seiki Seisakusho KK
Original Assignee
Sanjo Seiki Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanjo Seiki Seisakusho KK filed Critical Sanjo Seiki Seisakusho KK
Priority to JP3161883A priority Critical patent/JPS59156725A/ja
Publication of JPS59156725A publication Critical patent/JPS59156725A/ja
Publication of JPH0332451B2 publication Critical patent/JPH0332451B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/20—Injection nozzles
    • B29C45/23—Feed stopping equipment
    • B29C45/231—Needle valve systems therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP3161883A 1983-02-25 1983-02-25 射出成形機のノズル装置 Granted JPS59156725A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3161883A JPS59156725A (ja) 1983-02-25 1983-02-25 射出成形機のノズル装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3161883A JPS59156725A (ja) 1983-02-25 1983-02-25 射出成形機のノズル装置

Publications (2)

Publication Number Publication Date
JPS59156725A true JPS59156725A (ja) 1984-09-06
JPH0332451B2 JPH0332451B2 (en]) 1991-05-13

Family

ID=12336197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3161883A Granted JPS59156725A (ja) 1983-02-25 1983-02-25 射出成形機のノズル装置

Country Status (1)

Country Link
JP (1) JPS59156725A (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010505673A (ja) * 2006-10-23 2010-02-25 ハンド スチール カンパニー リミテッド 射出機用ノズルアセンブリー
CN115036226A (zh) * 2022-08-11 2022-09-09 深圳市中讯恒达科技有限公司 一种功率半导体模块封装结构

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5820426A (ja) * 1981-07-30 1983-02-05 Toshiba Mach Co Ltd 射出成形機のバルブノズル

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5820426A (ja) * 1981-07-30 1983-02-05 Toshiba Mach Co Ltd 射出成形機のバルブノズル

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010505673A (ja) * 2006-10-23 2010-02-25 ハンド スチール カンパニー リミテッド 射出機用ノズルアセンブリー
JP4750208B2 (ja) * 2006-10-23 2011-08-17 ハンド スチール カンパニー リミテッド 射出機用ノズルアセンブリー
CN115036226A (zh) * 2022-08-11 2022-09-09 深圳市中讯恒达科技有限公司 一种功率半导体模块封装结构

Also Published As

Publication number Publication date
JPH0332451B2 (en]) 1991-05-13

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